It’s been quite some time since Samsung Electronics has become the world leader in advanced semiconductor technology. Today there was an announcement by Samsung declaring that its Foundry Business has commenced mass production of System-on-Chip (SoC) products. Samsung’s second-generation 10-nanometer FinFET process technology, 10LPP (Low Power Plus) will be used to build these products.
Compared to Samsung’s first generation 10nm process technology 10LPE (Low Power Early), the latest 10LPP process technology guarantees up to 10% higher performance with 15% lower power consumption. Since this process is a modification of the already proven 10LPE technology, it also comes with many competitive advantages. Apart from reducing the turn-around time from development to mass production, it also provides a significantly higher initial manufacturing yield.
The digital devices that will contain the SoCs designed with 10LPP process technology are expected to hit the market early next year. The device will become more widely available throughout the entire year.
Ryan Lee, vice president of Foundry Marketing at Samsung Electronics, was quoted as, “We will be able to better serve our customers through the migration from 10LPE to 10LPP with improved performance and higher initial yield. Samsung with its long-living 10nm process strategy will continue to work on the evolution of 10nm technology down to 8LPP to offer customers distinct competitive advantages for a wide range of applications.”
Samsung has recently inaugurated its latest manufacturing line, S3, in Hwaseong, Korea. It’s been officially declared by Samsung that S3 is prepared to ramp up the production of process technologies including 10nm and below. S3 will also produce the 7nm FinFET process technology with EUV (Extreme Ultra Violet). S3 will be the third fab of Samsung’s Foundry Business. The previous ones, S1 & S2 are situated in Giheung, Korea and Austin, USA, respectively.