Intel just launched the 8th Gen Intel® Core™ processor. It is equipped with Radeon™ RX Vega M Graphics and has got features that are quite sure to impress the gamers, content creators and fans of virtual and mixed reality. It will be optimized for the 2 in 1s, thin and light notebooks, and mini PCs.
The processor comes in two different configurations, one with the Radeon™ RX Vega M GH Graphics (100W total package power) and the other with the Radeon™ RX Vega M GL Graphics (65W total package power). The first configuration features an unlocked configuration.
The chip maker has also launched the latest and most powerful Intel® NUC designed to complement the latest processor. This latest NUC puts the powerful new processor and graphics solution into an incredibly tiny 1.20-liter system making it the manufacturers smallest premium VR-capable system in the market.
The latest NUC comes in two versions as well, the NUC8i7HVK and the NUC8i7HNK. The NUC8i7HVK is based on the unlocked version of the new 8th Gen Intel Core processor which is accompanied by the Radeon RX Vega M GH graphics. It enables the overclockers to take the system to higher levels. The NUC8i7HNK, on the other hand, uses the 8th Gen Intel Core processor with the Radeon RX Vega M GL graphics.
Both the NUCs promise ultimate connectivity due to the inbuilt dual Thunderbolt™ 3 ports and dual Gigabit Ethernet ports. It will help them to support the fast processing and graphics horsepower. The system is capable of driving six independent monitors simultaneously. It has one of the HDMI ports on the front of the unit, making it easier to plug in the VR headset. DIYers who prefer small, sleek and powerful mini PCs can buy these NUCs as bare-bones kits, which will be made available from this coming spring.
Details about the latest 8th Gen Intel Core processor family was first announced in early November. The combination of the Intel quad-core CPU, Radeon RX™ Vega M graphics and 4GB of dedicated HBM2 accompanied by Intel’s Embedded Multi-Die Interconnect Bridge (EMIB) technology is sure to impress the users. The EMIB works like a smart high-speed information bridge between the GPU and HBM2. It approximately halves the silicon footprint compared to the arrangement where the discrete components implemented separately, giving more freedom and flexibility to the OEMs to create innovative, thin and light devices. Devices, that used to be nearly 7 pounds heavy, 32 mm thick & lasted only 4 hours can now be slimmed under 17 mm while lasting almost 8 hours on a single charge alongside delivering next-level performance. This architecture backed up with the real-time power-sharing framework and software drivers is the perfect example of the next generation device.
In addition to the Intel NUC and new Dell and HP devices, the latest Core processor comes with the latest gaming cloud solution by Artesyn and Gamestream. More can be expected from the American Multinational Corporation on the high-end performance notebook segment and the Core H-series. With the Intel® Optane™, the company plans to introduce the 8th Gen Intel Core in mobile devices for the very first time. The 8th Gen Intel® Core™ vPro™ platform will be introduced as an exclusive business platform.
A huge variety of new 8th Gen Intel Core devices will be displayed at the company’s CES booth, 100048 in Central Hall South at the Las Vegas Convention Center.
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