Xiaomi has released high-resolution images of its upcoming flagship, Mi Mix 2S, which details the phone’s external design. The flagship, scheduled to be launched on 27 th March 2018, appears to have been designed with an almost bezel-less screen, with 2-3 mm wide frames on three sides and a 7mm wide bezel at the bottom.
The phone’s speaker has been integrated into its top, and the bottom indentation carries the camera and other sensors. The image shows that the phone has a ceramic case, and a proprietary inscription on the back cover indicates that the mobile device belongs to the line of premium phones. The upper left corner of the phone’s back carries a horizontally arranged dual camera. The right side of the phone sports an on/off button and a volume button, while the bottom of the phone has made space for a USB Type-C connector (3.1), and in all probability 3.5 mm headphone jack.
As far as the technical aspects of the device are concerned, it is said that the phone’s display has an aspect ratio of 19: 9 and a resolution of 2240×1080 pixels. Additionally, the phone seems to have been equipped with dual 12 Megapixel main and 8 Mp front cameras, a 3340 mAh battery with fast QC charging and wireless charging support, and can shoot slow motion video at 960 frames per second.