Samsung Co. and the Korean Intellectual Property Office (KIPO) filed a patent under the application number ‘1020180096240.’ The newly spotted patent suggests that the company has been trying to patent a Samsung liquid cooling system for months that are found in handsets.
Though the request was made by Samsung on August 17 but in point of fact, it was filed with the agency since November 2016. A big difference in design has been established between the described listing and the one used in the flagship devices.
The use of a carbon-fiber in the two thermal interface materials (TIMs) surrounding the copper cooling component was not cited in the patent listing, apart from this the other settings appear to be fairly the same. The patent does describe the use of a copper cooling element embedded within two liquid-infused TIMs.
Furthermore, the descriptions and images appear that the heat sink is placed in the same position as is seen in the specified devices such as the Galaxy S9, Galaxy S9 Plus, and Galaxy Note 9. Samsung liquid cooling system earlier to these was 2.7 times the size hence enabling better heat spreading though it’s positioning between components, shape, and most materials used appear to be exactly the same.
Meanwhile, it seems an error on Samsung’s part considering the time of the filed patent and the similarities found among its many smartphones. The company may have simply derelict to explain the technology in its original patent excluding the use of carbon materials that help in improving its heat transfer in the devices and directed away from key components. Hence this might explain why the patent has taken well over a year to be reviewed and finalized by KIPO.