While Xiaomi Mi8 is only a few months old, rumors of Xiaomi’s next flagship, Mi9, has already started making rounds on the internet.

Concept designer and famous tipster, Ben Geskin, has shared on Twitter what may be the possible render and specifications of the upcoming smartphone. With a smaller notch, somewhere in-between a regular notch and a water-drop notch, the smartphone may also be equipped with a 6.4-inch AMOLED display, along with an in-display fingerprint sensor.

The device’s rear camera seems to boast of a triple-camera module with LED flash, with the flash being positioned between two camera sensors in an oval-shaped arrangement while the third one goes under it. The camera specifications include possibilities of the setup being equipped with a 48MP Sony IMX586 primary sensor, a 13MP secondary sensor, and a 16MP third camera sensor.

Rumored to be the first smartphone which shall make use of the upcoming octa-core Snapdragon 8150 chipset; the device may come in variations of 6GB/8GB/10GB RAM. The device shall also feature a 3700mAh battery, with support for Quick Charge 5.0 fast charging technology; while its glass rear as seen on the concept render suggests possibilities of wireless charging facilities.

Apart from the Xiaomi Mi Mix 3 5G with the next-generation wireless connectivity support that has already been confirmed to be unveiled in China in the first quarter of 2019; the company’s upcoming flagship, Mi9, is also expected to boast of 5G connectivity.

Xiaomi Mi9 is expected to be announced sometime in the first half of 2019.