In a recent news update, Xiaomi President Lin Bin has confirmed the launch of a brand new Xiaomi phone with a 48-megapixel rear camera. Although this announcement has already created a frenzy among the Xiaomi fans who are speculating this new device to be the much-awaited Xiaomi M9, recent reports suggest that this new phone could be the first Redmi series flagship phone. Expected to go official within January 2019, this much-hyped phone is speculated to come with an in-screen camera hole display design.
Expected to be powered by Snapdragon 675, this Redmi flagship phone will be equipped with an LCD panel supplied by China’s BOE display maker. With the in-screen camera trending in the smartphone market, this phone too is expected to have an impressive screen to body ratio going with the likes of Samsung Galaxy A8s and the upcoming Huawei Nova 4.
Although everything is kept under wraps regarding this new smartphone from Xiaomi, this phone is speculated to have a super wide angle lens to top the 48-megapixel sensor. Although the specs make it a costly phone to manufacture, smartphones enthusiasts are reportedly expecting this phone to cost about 2000 Yuan in China.
Another leak which has recently surfaced regarding this phone is that the camera department would feature the Samsung ISOCELL Bright CM1 48 megapixel sensor, unlike the Sony IMX586 sensor. Also, after the launch of 11nm Snapdragon 675 chipset by Qualcomm in October, Xiaomi had officially confirmed that they would be using this SoC to power their new smartphones. Xiaomi President recently released an image regarding the new Redmi smartphone, suggesting that this could be the first phone in the Redmi series to have a glass panel on its rear.