Samsung Electronics has publicized that it has begun the mass production of its highest capacity of mobile Dynamic Random Access Memory (DRAM). Samsung Electronics said on March 14 that it has already started mass producing the world’s highest-capacity mobile DRAM chip tailored for premium mobile devices, such as foldable smartphones.
The new chip is built by combining six second-generation 10-nanometer-class 16-gigabit (Gb) LPDDR4X DRAM chips into a single 12GB DRAM package to offer 1.5 times higher capacity than the predecessor 8GB mobile DRAM commonly used for powering an ultra-slim laptop, according to the company.
The 12GB LPDDR4X mobile DRAM will enable high-spec smartphones to run applications better and faster, claimed the company. Smartphones are becoming more advanced, featuring bigger and multi-screens, five or more camera modules, artificial and 5G capabilities. Last month, the Korean tech giant unveiled a double-screen foldable handset fitted with multiple high-end features.
However, currently, Galaxy S10+ Ceramic Edition and the Galaxy Fold foldable smartphone are the only products that are in Samsung’s current lineup with 12GB of RAM. Both devices use a different technology than the one above. The mobile DRAMs inside them are manufactured of 20nm architecture, instead of a 10nm that is mostly found in the latest generation of devices. The new 12GB RAM standard and the currently announced 512GB UFS 3.0 storage will be seen in devices starting next year.
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