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Sony introduces next-generation stacked CMOS image sensor

Mar 18, 2019, 4:00 am

The “CMOS Digital Camera” report put strong focus over some of the significant sections of the CMOS Digital Camera market. It also provides us with the general idea of the rise in demand for the CMOS digital camera.

Just as CMOS sensors have replaced CCD devices, the emergence of newer, niche-based imagers is expanding the functionality of machine vision applications. Sony has developed a Stacked CMOS Image Sensor Technology with back-illuminated pixel structure for a distortion-free image performance.

The image sensor developed by Sony layers the pixel section containing formations of back-illuminated structure pixels onto chips which is in place for supporting substrates for conventional back-illuminated CMOS image sensor technology. This technology will further enhance image quality, superior functionalities and a more compact size that will lead to enhanced camera evolution.

Sony is to position it as the next-generation back-illuminated CMOS image sensors that will be determinant to further develop this image sensor and expand its product lineup, thereby aiming for a user-friendly camera that will be fun to shoot with.

The popularity of smartphones has been in hype in recent years with the increasingly diverse use of camera functionality along. And this has been the reason for heightened demand of more sophisticated cameras along with this stacked CMOS image sensor to meet such demand. Besides the higher pixel numbers, the superior image quality and also faster speeds that the standard image sensors pursued, the newly-developed image sensors further achieves more highly-advanced functionalities with more compact size, hence paving the way for enhanced camera evolution.

Sony has successfully established a structure that layers the pixel section containing formations of back-illuminated structure pixels, and by this stacked structure, large-scale circuits can now be mounted beside the small chip size. Moreover, as the pixel section and circuit section are formed, a manufacturing process can be adopted, allowing the pixel section to be specialized for higher image quality.

This new technology will be debuted in Shanghai on March 20, 2019.

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