- Jul 26, 2021
Named after the ancient capital kingdom of Hawaii, Snapdragon 875 new internal codename ‘Lahaina’ is on the news this time. Outsourced on a recent tweet by Mr. Roland Quandt, this social media post has become a sensation outright.
As Qualcomm’s next-gen platform, Snapdragon, aka. Lahaina is supposed to be disclosed soon. However, the practical mounting of it for commercial usage via smartphone is not so more quickly an event before 2021.
Built on a 5nm process, Qualcomm Snapdragon 875 and X60 5G basebands have been officially put into mass production at TSMC and are expected to be delivered soon. Qualcomm will further adopt both Cortex X1 + Cortex A78 as the core combos, later updating it to Snapdragon X60 5G baseband.
Mass-produced by TMSC this new development might quicken charging by 100 watts and will come with several key features such as –
Kryo 685 CPU built on Arm v8 Cortex tech, 3G/ 4G/ 5G modem – Millimeter wave (mmWave) and sub-6 GHz bands, Adreno 660 GPU, Adreno 665 VPU, Adreno 1095 DPU, Qualcomm Secure Processing Unit (SPU250), Spectra 580 image-processing engine, Snapdragon Sensors Core Technology, External 802.11ax, 2×2 MIMO, and Bluetooth Milan Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator, Quad-channel package-on-package (PoP) high-speed LPDDR5 SDRAM, Low-power audio subsystem combined with Aqstic Audio Technologies WCD9380 and WCD9385 audio codec.