AMD’s next-gen ZEN 3-based processors will have the 5000 series nomenclature and will be up for the Desktop CPUs and RDNA 2-based Navi 2X GPUs in the second half of 2020. The new processors have been codenamed as ‘Vermeer’.
Vermeer series of processors will feature a new Zen 3 CPU architecture, changing the core designs as well. It will improve the single-threaded and multi-threaded IPC boosts. If this is teamed with higher clock speeds, the users can expect significant performance gains.
The 4000 series is expected to remain exclusive to Renoir FP6 (the mobile lineup), and the Renoir AM4 desktop series of processors. Two new SKUs, the Ryzen 9 5900X and Ryzen 7 5800X having 12 and 8 CPU cores, respectively have been however discovered for the new series.
It will have a similar core count as the current Ryzen 3000 series lineup. The AMD Ryzen 9 5900X is expected to feature 12 cores, and the Ryzen 7 5800X will get 8 cores in total. Igor’s Lab has recently reported on some Vermeer engineering samples boosting up to 4.9 GHz, and it was previously presumed that the Zen 3 processors could have the 5000 series name.
The Ryzen 5000 series will have max out 12 cores instead of 16. The new series will likely have TSMC’s 7nm+ EUV process node, the Zen 3 architecture is said to deliver better performance per watt ratio and efficiency than the previous Zen 2 lineup, and might also feature up to two CCD’s (Core/Cache Complex Dies) and a single IOD (I/O Die).
The new architecture might at least 15-17% IPC uplift compared to the previous-gen Zen 2 CPU lineup. Zen 2 CPUs already featured double the L3 cache over the Zen/Zen+ series chips. Some AMD CPUs can go as high as 5 GHz, to give Intel a stiff competition on the single-core frequency, along with a 50% increase in Zen 3’s floating-point operations and a major redesigning of the cache.
The new Vermeer series of processors will have the multi-chip module (MCM) approach, also called the chiplet design. The Zen 3 will be having the support for a Curve Optimizer. This feature will allow users to configure the boost of the Ryzen CPU.
The frequency for each core can be customized without any restrictions. There will also be Infinity Fabric dividers. Thus one can get the memory controller frequency slightly higher in mixed mode, and thus should provide more flexibility to the memory controller frequency configurations, such as mixed mode.
BIOS’s microcode will also feature the Infinity Fabric dividers and there will be distributed load on the CCD’s with each CCD getting an equal proportion of cores. AMD Zen 3 processors will also have a unified L3 cache for each Zen 3 chiplet making the cache approach of L3 more feasible across the entire Zen 3 chiplet.
Larger cache sizes could actually mean longer cache latencies, and this is true for Zen 3 CPUs, but this will not affect the performance. The CPU cores can now share the information more easily. Larger cache sizes could help with boosting Zen 3’s multi-threaded, as well as gaming performance.
AMD’s Senior Vice President, Forrest Norrod Said about the architecture of the new series “So you know that first Zen 1 Core was great and hugely cored, but Zen2 was as well. And Zen 3, that’s at the heart of our next-generation products is also a tremendously powerful architecture and you know right on the trajectory that we needed to be on”,
Thus their new architecture will power its next-generation Ryzen 5000 CPU lineup and that AMD is working on a regular cadence of new CPU cores and building a next-gen CPU roadmap that’s both high-performance and will be performing greatly in the near future.