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Intel Announced Expansion of Foundry Partnership to Use TSMC Advanced Manufacturing Process

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Yusuf Balogun
Yusuf Balogun
Yusuf is an aspiring Journalist and Health law expert with a special focus on technology innovations. He is a writer at Right for Education, Libertist Centre for Education, Qwenu, and Editor at Gamji Press, UDUS.

During the Architecture Day on August 20th, Intel announced that key components of the forthcoming Intel® RuixuanTM and Ponte Vecchio graphics cards would be manufactured using 5nm and 6nm advanced support. Intel is participating for the first time. For product production, use external foundries’ innovative process technology.

According to the reports, Intel® Ruixuan is a brand-new game discrete graphics SoC based on the Xe-HPG microarchitecture and scalable to enthusiast-level solutions. In contrast, Ponte Vecchio is primarily based on the Xe-HPC microarchitecture and oriented to high-performance computing and artificial intelligence. Intelligently distribute tasks.

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While according to the senior vice president of Intel’s Enterprise Planning Division, Stuart Pann, the external foundries now produce 20% of Intel’s goods, and Intel has become one of TSMC’s most important customers.

Previously, Intel’s collaboration with foundries was limited to specific product lines like Wi-Fi modules, chipsets, and Ethernet controllers. These devices utilize mature process nodes to complement Intel’s sophisticated process technology.

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Intel CEO Patrick (Pat) Gelsinger unveiled the IDM 2.0 plan in March of this year, pushing the company’s IDM model evolution and upgrading, as well as extending the company’s collaboration with major foundries. The initial phase of this progression, which used TSMC’s advanced process technology, culminated with the debut of the Xe series of graphics products.

“We’ll choose the most appropriate process node for the architecture, just as our designers chose the right architecture for the right workload. For Intel’s discrete graphics products, the foundry manufacturing node is acceptable,” Stuart Pann stated.

The heterogeneous mix and match of chips with diverse process nodes is poised to become the chip industry’s next major innovation. Intel’s excellent packaging technical advantages will be better used when more semiconductor products transition from SoC to on-chip packaging solutions. He added.

However, some reports have revealed that Intel has also turned over certain support units to TSMC to mass manufacture the new Meteor Lake client computing products.

Intel has made explicit plans for large-scale investment in new plants, but constructing and assembling new cutting-edge fabs will take several years. In the coming years, chip units produced by external foundries will play a larger part in Intel’s products. 

Stuart Pann maintained that: “It is critical to have a supply chain that is both agile and resilient. To ensure that our clients’ short-term supply needs are addressed, we will use all available ways.” 

 

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