Today, the Chinese technology company, OPPO has officially announced that it’s going to unveil the first self-developed chip or adopt TSMC’s 6nm process in the middle of this month.
According to the Chinese tech giant, the self-developed chip will be officially unveiled at 16:00 on December 14, 2021.
According to reports, OPPO has a chip R&D team of over 2,000 individuals, with the majority of the team’s R&D personnel coming from organizations with significant technological experience, such as Qualcomm and Intel.
The media has also reported that OPPO’s chip development has advanced significantly. Its first chip, an independent neural processing unit (NPU), was taped off in June this year and was made utilizing TSMC’s 6nm technology.
The OPPO Future Technology Conference will be held in Shenzhen from the 14th to the 15th of this month. The conference’s major theme is “Perfect Forward.”
At the conference, OPPO will unveil its flagship new goods as well as a variety of new innovations.
In the official OPPO announcement, one of the conference’s biggest stories should be the self-developed chip.
Major domestic manufacturers are currently pursuing opportunities in the chip business. In addition to Huawei’s HiSilicon, which has been around the longest and is the most mature, Xiaomi and Vivo have released two self-developed chips, the surging S1 and V1, respectively.
In recent times, the global shortage of chips has been a major drawback for technology companies.
TechGenyz reported this month that Alibaba Dharma Institute has successfully developed the world’s first, DRAM-based 3D bonded stacking storage-calculation integrated chip.
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