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Samsung to Partner With Mediatek to Optimize 200MP Sensor

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Yusuf Balogun
Yusuf Balogunhttps://mssg.me/q19uh
Yusuf is a fresh law graduate and freelance journalist with a special interest in tech reporting. He joined the tech sphere in 2019 and has written several articles. He believes in tech innovations as an aspiring health law expert, in the future, Yusuf hopes to use the same for solving global health challenges.

The report revealed earlier this morning that the South Korean multinational electronics corporation Samsung has partnered with the Taiwanese fabless semiconductor company MediaTek to optimize the 200MP sensor.

The information was contained in a Twitter post by Ice Universe today, December 16. The tweets confirmed the partnerships between the companies, and Samsung congratulated MediaTek on the release of the D9000 processor.

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Knowing about this partnership, people are talking about Exynos chipset, which they didn’t like much. Also, tech enthusiasts are waiting for some kind of news of Exynos 2200.

In recent times, Samsung has continued to push the boundaries of mobile image sensors with its 200 MP ISOCELL HP1 sensor. This sensor is yet to make its way to retail hardware, but in September this year, Samsung posted a short explanation and video of what users can expect.

The 200-megapixel (MP) image sensor was recently introduced by Samsung, equipped with 0.64m pixels, and the ISOCELL GN5, the first image sensor to adopt all-directional focusing Dual Pixel Pro technology with two photodiodes in a single 1.0m pixel.

Speaking about the 200MP sensor, when introduced the executive vice president of sensor business at Samsung Electronics, Duckhyun Chang said: “Samsung has been pioneering ultrafine pixel technologies that are taking high-resolution image sensors to the next level.”

“With the ISOCELL HP1 that is breaking barriers and ISOCELL GN5 bringing ultrafast autofocus, Samsung will continue to lead the trend for next-generation mobile imaging technologies.”

MediaTek unveiled the D9000 processor during the MediaTek Summit conference this year, seen as the first groundbreaking chipset. The Dimensity 9000 5G is the first chipset manufactured by TSMC using the 4nm technology. Because it’s a 4nm chip, it has a higher density – 6 percent to be exact -allowing it to increase its capabilities even more. In this situation, it is improved performance as well as superior power efficiency.

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