Technology super giants are about to join hands to produce visionary chips; the Japanese semiconductor manufacturing firm “Rapidus” plans to confine Next-generation supercomputer chips.
It would now be shaking hands with IBM while expanding its gratitude to the company in the United States. The company seems to be cooking Chips required to build IBM supercomputers.
While visiting the United States of America on Jan 5, Japanese Minister of Economy, Trade, and Industry Yasutoshi Nishimura said that Rapidus and IBM apprised the Japanese and US governments.
Yasutoshi Nishimura and U.S. Secretary of Commerce Raymondo had a brief discussion on January 5th, while officials from Rapidus and IBM were also there at the meeting. Information from reports states that IBM and Rapidus will move along with dreams on their hunting wagon while carrying research and development strategies and ensuring the production of the most advanced chips.
The supercomputers from IBM start from scratch with nuanced supercomputer chips said to be made by Rapidus. Mainichi Shimbun reported on January 6th that Nishimura Yasutoshi and Raimondo agreed to a specific deal at the meeting; Uthe S is broadening the field of economic security.
To know the partnership of Rapidus and IBM, we need to whirl the wheel of time a bit to travel back to December 2022, not long ago, but a year has been crossed. If we’d say so, Rapidus announced on December 13 that IBM welcomed the company to enable the strategic partnership to develop next-generation semiconductors (2nm chips).
Further, Rapidus undisclosed on December 6 last year that the company had agreed on a memorandum of understanding with “imec,” a Belgian research institute.