MediaTek Dimensity 7200 is Announced, Built on a 4nm Process

The staff of Taiwan-based semiconductor firm MediaTek Dimensity has now entered the low-cost range; the company is today unveiling its new Dimensity 7200 chipset, which is designed on a 4nm process.

The chipset is going to appear on the market next month. The new chipset from MediaTek has a chunk of whip card that could make the chip sit in the catbird seat.

The Dimensity 7200 is 5G-capable, which is the first of its kind. Why it could have reached the pinnacle of its competitors hadn’t caught it trawling. Perhaps the best thing the company has done with the chipset is to have something swirl around the table.

Specifications of Dimensity 7200

The Dimensity 7200 is built using a 4nm process, the same process used for MediaTek’s flagship Dimensity 9200, and Qualcomm’s Snapdragon 8 Gen 2 has its own role in securing the 4nm process. It is worth mentioning that most of the mid-range chips were obliged to be built on less-efficient, more bygone build processes. The chip is also constructed by TSMC, which only multiplies the efficiency boosts.

Dimensity 7200 comes with an octa-core design, assembled with two Cortex-A715 cores at 2.8 GHz and six Cortex-A510 cores. It also offers support for Arm’s Mali-C610 MC4 GPU and MediaTek’s HyperEngine 5.0, which offer quite good gaming enhancements. The chip’s modem has support for sub6 5G networks and Wi-Fi 6E and Bluetooth 5.3/LE.

The Modernistic Feature of Dimensity 7200

Let’s talk about the modernistic features that the Dimensity 7200 has to float on the river. The 7200 has some subtle features that would evenly distribute power to the device.

It includes 4K HDR video recording coupled with cameras that would hit up to 200MP, recording videos from two cameras at once and FHD+ displays partnered with 144Hz. Memory can reach up to 6,400Mbps and port FS 3.1 storage. The MediaTek Dimensity 7200 will make its debut in new Android smartphones launching in Q1 2023.