In May this year, Chinese mobile giant Xiaomi unveiled its high-range smartphone – the Xiaomi Civi 3 with cutting-edge features. Now, it seems the brand is swiftly moving ahead with the development of its next flagship, as recent reports from Mobile China indicate that Xiaomi is gearing up to launch the Xiaomi Civi 4 in March next year, with a key feature being the MediaTek Dimensity 8300 Ultra chip.
As the media outlet reported, when a smartphone with the model number 24031PN0DC surfaced in the GSMA IMEI database in September, rumors about the Xiaomi Civi 4 began to pick up steam. Since then, foreign media has conjectured that this entry is probably related to the impending Xiaomi Civi 4. The excitement increased when a reliable tipster on social media channels recently revealed something.
The MediaTek Dimensity 8300 Ultra chip, a noteworthy selection shared with the soon-to-be-released Redmi K70E smartphone, is rumored to power the Xiaomi Civi 4. This chip, which is in the same series as the Dimensity 8300, is said to have undergone certain modifications to satisfy Redmi and Xiaomi’s specifications. Fascinatingly, the Dimensity 8200 Ultra chip is also present in the Xiaomi Civi 3.
Meanwhile, netizens have fueled the rumors by raising the possibility of an acceleration in the Xiaomi Civi 4’s development or release schedule, implying that the phone has “accelerated.” There are also rumors that the gadget would have an improved front beauty light and a rear Howey sensor, which would improve its photographic skills.
Although the Xiaomi Civi 4’s exact features have not yet been made public, the model number 2403 suggests that it may launch in March 2023. Building on the popularity of its earlier models, Xiaomi appears ready to keep emphasizing aspects like cutting-edge photography capabilities and creative look designs. Thus, stay connected with TechGenyz for more updates on the upcoming Xiaomi smartphone.