Apple’s AR/MR headset shipping date will be postponed to the Q2 of 2023: Ming-Chi Kuo

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Yusuf Balogun
Yusuf Balogun
Yusuf is an aspiring Journalist and Health law expert with a special focus on technology innovations. He is a guest writer at Qwenu and Deputy Editor-in-chief of Gamji Press.

Yesterday marked another milestone in the technology industry, as the world witnessed the beginning of Apple’s annual Worldwide Developers Conference – the WWDC 2022. This year’s event is the 33rd series of the Worldwide Developers Conference, and it’s expected to feature the launch of new Apple software and hardware products.

As we reported late last month, Tianfeng International Securities analyst Ming-Chi Kuo revealed Apple would not release AR/MR headset and reality system during the 2022 WWDC event. According to him, the mass production of the AR/MR headset will take Apple so many times.

He further pointed out that Apple’s global competitors are eagerly awaiting the hardware specifications and operating system design of Apple’s AR/MR headset. Therefore, if Apple announces an AR/MR headset and its operating system at WWDC, competitors would instantly start copycat projects and gleefully imitate Apple’s outstanding ideas, preempting Apple’s products from hitting the market in 2023.

However, in a new analysis shared via its Twitter handle, the Tianfeng International Securities analyst explains why Apple’s AR/MR headset and reality system shipping date will be postponed to the second quarter of 2023. He highlighted several reasons, which include the recent Shanghai lockdown, which interrupted the development.

Other reasons are that the EVT certification is expected to commence by the third quarter of 2022. The delivery of the development toolkit is estimated to take two to four weeks after the WWDC22 event by June 10, as well as the January 2023 media event and the hitting store shelves.

In addition, as per reports, the pre-ordering of Apple’s AR/MR headset is expected to be initiated by the second quarter of 2023. According to the Ming-Chi Kuo, the devices will use dual ABF carrier boards, and each Apple AR / MR headset will be equipped with dual CPUs produced by 4nm and 5nm, and the dual CPUs are Using the ABF carrier board, the computing power is about 2-3 years ahead of the competitor’s product.

In a nutshell, the Tianfeng International Securities analysis is believed to be an accurate picture of the situation, given his explanations. He is one of the most popular and reliable Apple leakers. However, this is just a mere opinion that can not hold water until the tech giant has its final affirmation on the matter. Therefore, stay connected with TechGenyz for more latest tech updates.

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