On 13th December 2018, MediaTek announced the next-gen Helio P90 chip for the affordable flagship killer smartphones. MediaTek claims that the chipset will provide the ability to OEMs of better camera features, battery life, and performance over AI. The next-gen system-on-chip (SoC) features advanced AI engine which can deliver AI experience 4x more powerful than its present Helio P60 and Helio P70 SoC.
The MediaTek Helio P90 SoC comes with an octa-core CPUs based on 2 x ARM Cortex-A75 cores clocked up to 2.0 GHz, and 6 x ARM Cortex-A55 cores up to 2.0 GHz. These cores are arranged in big.LITTLE architecture process coupled with PowerVR GM 9446 GPU. The Helio P90 SoC follows the launch of the Helio P70 SoC, which also featured a dedicated AI engine, and is expected to be available globally in consumer devices in the first quarter of 2019.
The Helio P90 supports up to a 48-megapixel camera or 24+16 MP dual-cameras and allows 30 frames per second (FPS) with zero shutter delay, or super slow-motion at 480FPS in HD. The chip supports dual-SIM dual VoLTE, 2 x 2 Wi-Fi 802.11ac, Bluetooth V5.0 and more as connectivity options.
Along with the new launch the company is also prepping to launch its first 5G-ready chipset at the upcoming Mobile World Congress 2019. Recently, the company announced its first MediaTek Helio M70 5G baseband chipset at the China Mobile Global Partner Conference in Guangzhou.
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