AMD unveils a new Genoa-X Snapdragon processor with 96 cores, confirmed the latest roadmap

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Yusuf Balogun
Yusuf Balogun
Yusuf is an aspiring Journalist and Health law expert with a special focus on technology innovations. He is a guest writer at Qwenu and Deputy Editor-in-chief of Gamji Press.

Yesterday marked another landmark in the technology industry as the world witnessed AMD’s 2022 Financial Analyst Day. The event showcases the progress made in the sector as the American semiconductor company confirmed its data center CPU roadmap.

Aside from the CPU roadmap, the event also featured the launch of a new custom chip designed for the telecom market, based on the Zen 4 architecture and optimized for energy efficiency. The new Genoa-X, a variant of the EPYC 7004 series Zen4 Genoa featured a 3D V-Cache technology with over 1 GB of L3 cache.

Dan McNamara, AMD’s Senior Vice President and General Manager of Server, outlined the latest roadmap. According to the EPYC roadmap, AMD is working on four different EPYC CPU families based on the Zen 4 core architecture, as well as the next-generation Zen 5-powered Turing family.

AMD intends to concentrate on the SP5 platform, which is based on the LGA 6096 socket and will include three processor generations: Genoa, Genoa-X, and Bergamo. In 200-400W SKUs, AMD EPYC Genoa CPUs will have up to 96 Zen 4 cores, while Bergamo will have a total of 128 Zen 4 cores in 320-400W SKUs.

The SP5 platform is a high-end design with 1P and 2P support, up to 12-Channel DDR5 memory, up to 160 PCIe Gen 5.0 lanes, 64 PCIe Gen 3.0 lanes for CXL V1.1+, and up to 12 PCIe Gen 3.0 lanes. To begin, AMD has previously stated that EPYC Genoa would be compatible with the new SP5 platform, which includes a new socket, and that SP3 compatibility will be available until EPYC Milan.

New memory and capabilities would be supported by the EPYC Genoa CPUs. According to the firm, the SP5 platform will also include a completely new socket with 6096 pins grouped in the LGA (Land Grid Array) configuration. With 2002 more pins than the present LGA 4094 socket, this will be AMD’s largest rocket ever.

The socket will handle AMD’s EPYC Genoa processor as well as future EPYC models. When it comes to Genoa CPUs, the chips will have a whopping 96 cores and 192 threads. These will be based on AMD’s brand new Zen 4 core architecture, which is projected to produce enormous IPC boosts while using TSMC’s 5nm production node.

AMD will have to squeeze more cores into its EPYC Genoa CPU box to reach 96 cores. AMD claims to have achieved this by including up to 12 CCDs in their Genoa chip. The Zen 4 architecture will be used to power each CCD, which will have eight cores. We could be looking at a big CPU interposer, even larger than the present EPYC CPUs if this corresponds with the increased socket size. The CPU is believed to have a TDP of 320W, which may be increased to 400W.

Authoritatively, AMD is likely to unveil SP6, a new platform for low-end servers that will be more TCO-optimized. It will be a single-processor system with 6-channel memory, 96 PCIe Gen 5.0 lanes, 48 CXL V1.1+ lanes, and 8 PCIe Gen 3.0 lanes. The majority of AMD EPYC Zen 4 families will be released in 2023, with the Zen 5 ‘EPYC Turin’ expected to be available in 2024. Follow TechGenyz for the latest tech news.

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